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books
| book details |
Reliability Technology for Integrated Circuit Packaging
By (author) Bin Zhou, By (author) Yunfei En, By (author) Si Chen
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| on special |
normal price: R 7 177.95
Price: R 6 818.95
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| book description |
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress. Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of ""high-quality development"" a focus on reliability is essential to advancing manufacturing. Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
| product details |
Normally shipped |
Publisher | Springer Verlag, Singapore
Published date | 21 Apr 2026
Language |
Format | Hardback
Pages | 510
Dimensions | 235 x 155 x 0mm (L x W x H)
Weight | 0g
ISBN | 978-9-8195-3884-3
Readership Age |
BISAC | technology / electronics / general
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