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The Source/Drain Engineering of Nanoscale Germanium-based MOS Devices

By (author) Zhiqiang Li

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normal price: R 2 267.95

Price: R 2 153.95


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This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With  adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600℃ and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10−7Ω•cm2, respectively. Besides, a reduced  source/drain parasitic resistance is demonstrated in the  fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.

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Normally shipped | Usually dispatched in 3 to 4 weeks as supplier is out of stock
Publisher | Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
Published date | 7 Jun 2018
Language |
Format | Paperback / softback
Pages | 59
Dimensions | 235 x 155 x 0mm (L x W x H)
Weight | 0g
ISBN | 978-3-6625-7026-5
Readership Age |
BISAC | science / solid state physics


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