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books
| book details |
Testing of Interposer-Based 2.5D Integrated Circuits
By (author) Ran Wang, By (author) Krishnendu Chakrabarty
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| on special |
normal price: R 4 643.95
Price: R 4 410.95
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| book description |
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
| product details |
Normally shipped |
Publisher | Springer International Publishing AG
Published date | 9 May 2018
Language |
Format | Paperback / softback
Pages | 182
Dimensions | 235 x 155 x 0mm (L x W x H)
Weight | 0g
ISBN | 978-3-3198-5461-8
Readership Age |
BISAC | technology / electronics / circuits / general
| other options |
Normally shipped |
Readership Age |
Normal Price | R 5 840.95
Price | R 5 548.95
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