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books
| book details |
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
By (author) Xing-Chang Wei
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| on special |
normal price: R 7 030.95
Price: R 6 327.95
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| book description |
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
| product details |
Normally shipped |
Publisher | Taylor & Francis Ltd
Published date | 25 May 2017
Language |
Format | Hardback
Pages | 322
Dimensions | 234 x 156 x 0mm (L x W x H)
Weight | 624g
ISBN | 978-1-1380-3356-6
Readership Age |
BISAC | technology / electronics / circuits / general
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