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books
| book details |
Through Silicon Vias: Materials, Models, Design, and Performance
By (author) Brajesh Kumar Kaushik, By (author) Vobulapuram Ramesh Kumar, By (author) Manoj Kumar Majumder, By (author) Arsalan Alam
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| on special |
normal price: R 2 254.95
Price: R 2 029.95
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| book description |
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
| product details |
Normally shipped |
Publisher | Taylor & Francis Ltd
Published date | 30 Jun 2020
Language |
Format | Paperback / softback
Pages | 216
Dimensions | 234 x 156 x 0mm (L x W x H)
Weight | 453g
ISBN | 978-0-3675-7454-3
Readership Age |
BISAC | science / physics
| other options |
Normally shipped |
Readership Age |
Normal Price | R 2 652.95
Price | R 2 387.95
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Mason Coile
Paperback / softback
224 pages
was: R 520.95
now: R 468.95
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