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books
| book details |
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
By (author) Hengyun Zhang, By (author) Faxing Che, By (author) Tingyu Lin, By (author) Wensheng Zhao
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| on special |
normal price: R 7 028.95
Price: R 6 325.95
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| book description |
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
| product details |
Normally shipped |
Publisher | Elsevier Science & Technology
Published date | 15 Nov 2019
Language |
Format | Paperback / softback
Pages | 434
Dimensions | 229 x 152 x 0mm (L x W x H)
Weight | 700g
ISBN | 978-0-0810-2532-1
Readership Age |
BISAC | technology / electronics / microelectronics
| other options |
Normally shipped |
Readership Age |
Normal Price | R 10 040.95
Price | R 9 036.95
| on special |
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